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Dia Range

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D840

Multilayer ultra mICRO Drill

0.050 – 0.090 mm

D840

Multilayer Super mICRO Drill

0.100 – 0.190 mm

D840

 Multilayer Drill

0.20 – 1.15 mm

D835

mICRO Drill

0.20 – 0.65 mm

D835

Standard Drill

0.70 – 3.175 mm

D620

Multilayer Undercut Drill

0.15 – 0.65 mm

D635

Undercut Drill

0.20 – 2.50 mm

D546

 Slot Drill

0.30 – 3.175 mm

D835 / D534 / D532

 Inverse Drill

3.20 – 7.50 mm

                                                                                                                                                                   On request:Inch sizes / Special dimensions

Troubleshooting

Hole Registration Accuracy

Hole registration accuracy is measured by an AOI machine. As shown below, hole positional accuracy is affected by some causes, therefore by countermeasure these defects we can get better accuracy results.

     


Roughness of Hole Wall

The below pictures shows some very rough holes caused by drilling. This defect should be controlled to get the desired quality requirements.



Swarf Clogging

Poor swarf evacuation results in swarf deposit in the drilled hole and any space between the PWB and entry board.



Resin Smearing / Wicking

Resin is melted by heat of drilling and attaches to inner and copper layer. It prevents connection with the copper.



Drill Bit Breakage

Drill breakage is of two types:

  1. Deflected breakage.
    Radial force tends to break the drill at the end of flute.
  2. Twisted breakage
    Large torque tends to break the drill at the middle of flute



Burring

Burrs occur around drilled holes. It occurs on top and bottom boards.



Accurate Slot Drilling

Solution of short slot drilling by pre-drilling.